Jiangsu, China
Business Type:
Main Products:
Number of Employees:
Year of Establishment:
Management System Certification:
ISO9001:2008, ISO14001:2004, OHSAS18001:2007
Average Lead Time:
Peak season lead time: within 15 workdays
Off season lead time: within 15 workdays
OEM/ODM Service
Sample Available
MEI Awards

Diamond Wire, Wire of Diamond, Wire Saw 55um manufacturer / supplier in China, offering 55um Diamond Wire for Silicon Silicing 55um (0.70mm), 0.40mm Electroplated Diamond Wire Silicon Sapphire Bricking Core Wire, Electroplating Diamond Wire Saw Tool for Silicon Slicing 0.095mm (80um) and so on.

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Supplier Homepage Products Diamond wire for silicon 55um Diamond Wire for Silicon Silicing 55um (0.70mm)
  • 55um Diamond Wire for Silicon Silicing 55um (0.70mm)
  • 55um Diamond Wire for Silicon Silicing 55um (0.70mm)
  • 55um Diamond Wire for Silicon Silicing 55um (0.70mm)
  • 55um Diamond Wire for Silicon Silicing 55um (0.70mm)
  • 55um Diamond Wire for Silicon Silicing 55um (0.70mm)
  • 55um Diamond Wire for Silicon Silicing 55um (0.70mm)

55um Diamond Wire for Silicon Silicing 55um (0.70mm)

Get Latest Price
Min. Order / Reference FOB Price
50 km US $19-22/ km
Port: Shanghai, China
Production Capacity: 300, 000 Km/Year
Payment Terms: L/C, T/T, D/P, Western Union, Paypal
Application: Silicon
Type: Electroplating
Core Wire: 60um
Grit Size: 6-12um
Standard: Jb/T 12543-2015
Brand: Diasc

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Basic Info

Model NO.
Transport Package
HS Code
Spec and Test Way:
ItemsStandardTest EquipmentTest Way
Diameter(mm0.070+0.004/-0.004Digimatic MicrometerTesting the wire diameter of each section of the sample, and then rotate the sample 90°based on its own axis rotation center to test the diameter. Then average the data.
Cylindricitymm≤0.005Digimatic MicrometerThe difference of the mean of two direction of each sample (big value minus small value)
Grit(pc)90±10Electron MicroscopeTest the single side grit number with 2.00mm length diamond wire. Then rotate the wire 90°based on its own axis. Then average the data.
Grit percentage≥0.7Electron MicroscopeTest based on below picture
Breaking LoadN≥12Cupping MachineEach sample should be tested breaking load
Elongation Rate%≥1.5Cupping MachineEach sample should be tested enlongation rate
Tensile StrengthN/mm2≥4300Cupping MachineEach sample should be tested tensile strength
Free Circle Diametermm)≥80Range
Smallest unit10mm
Take 1m as the sample, then put it on the desk to test the smallest diameter.
AppearanceNo rust and dirtVisual InspectionEach product should be inspected before and after production
No peeling and fall off of nickel layerElectron MicroscopeEach product should be inspected before and after production

Specification of grit percentage test way:
Grit percentage reflect the evenness of diamond distributed on the wire. The bigger of the ratio, the even of the diamond distributed. Within the 1.50mm length, see pic1, the diamond grit percentage of both X side and Y side. Caculating as below:

RN=N1/N2 -----------(1)
Of which:
RN-------grit percentage
N1--------small value of X side and Y side diamond grit
N2--------big value of X side and Y side diamond grit

Electroplated diamond wire saw is a type of fixed abrasive diamond wire, which used extensively in the PV and Semiconductor industries for the cutting, grinding and polishing of silicon, sapphire, quartz, neodymium iron, boron, ferrite materials, ceramics, glass, hard alloy and hard brittle materials. 

-. With high accuracy, high cutting ability and strong stickiness of the diamond grit on wire, thereby guarantee the cutting productivity of the machining are 2 to 20 times of the mortar line
-. Improving the working environment (soluble water cutting fluid could be applied)
-. Effective recovery (chips to be separated and recycled easily)
-. To select suitable type of wire saw in accordance with the different of usage and demand

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